That the sector of power trips with remarkable rhythms, compared to other sectors of the electronics, is now a fact, thanks to the increasing search for intelligent solutions, reliable, energy-efficient and environmentally sustainable, necessarily related to the world of power.
Power Forum
The meeting point for those working in the world of power electronics
Bologna, 17 September 2015 – Zanhotel & Meeting Centergross
Promoted by Assodel, (Italian Association of Electronics Cluters ) in collaboration with the Consortium Elint, the Power Fortronic si è svolto a Bologna il 17 September scorso, the usual appointment with the Italian power electronics.
Richiedi gli atti dei convegni
L’eterna “lotta” tra tecnologie SiC (Silicon Carbide) e GaN (Gallium Nitride) ha tenuto banco anche nell’edizione 2015 of Power Fortronic, l’unico evento in Italia interamente dedicato all’elettronica di potenza che ha richiamato anche quest’anno centinaia di operatori. Particolarmente rilevante, tra i partecipanti, la presenza di grandi manufacturer di componenti elettronici per il power.
L’electronics community italiana, rappresentata da oltre 500 operatori del settore power, si è confrontata, every year, con aziende leader del settore, rappresentanti del mondo accademico ed esperti di mercato, su alcuni temi di forte attualità, selezionati dal Comitato Tecnico di Assodel, (Italian Association of Electronics Cluters ), storico promotore del forum verticale.
Protagonisti delle conferenze plenarie, dei workshop pomeridiani e dell’area espositiva, con oltre settanta di aziende, i semiconduttori di potenza e il loro impatto su affidabilità ed efficienza dei sistemi, le tecnologie per i veicoli elettrici e per i dispositivi di commutazione ultra-veloci, i convertitori di potenza avanzati, and, non meno importanti, i passivi.
Scenari di potenza
La seguitissima sessione plenaria “SiC e GaN si contendono la scena” ha offerto l’occasione di “vivere” l’elettronica di potenza vista da un laboratorio avanzato, grazie all’interessante intervento del prof. Roberto Petrella, dagli “Electric Drives Laboratory” dell’Università di Udine, che ha riportato l’esperienza diretta proveniente dalle industrie italiane più prestigiose del settore con cui EDLab ha collaborato nello sviluppo di prodotti all’avanguardia. Also, apprezzati gli speech proposti dai rappresentanti di Infineon Technologies, ST Microelectronics, Cree Power/Richardson RFPD, MacMic Science & Technology/EDO Components, Rohm Semiconductor e Fuji Electric.
In contemporanea, “Soluzioni, architetture e supporto” con gli interventi di altrettanti leader del settore quali Power Integration, Keithley/Tektronix – RS Components, Vicor/Arrow Electronics, Keysight Technologies, Rutronik e Rohm, Recom, Linear Technology/Arrow Electronics e Silicon Labs/Melchioni.
Workshop ed educational
Il Power Fortronic 2015 ha confermato il “sold-out” dell’ormai tradizionale appuntamento con gli educational di Infineon Technologies, dedicati a Low Voltage e High Voltage Drives, oltre al rinnovato interesse nei confronti delle novità tecnologiche proposte nei workshop di Mitsubishi Electric/Melchioni, Hirose/Orvem, Wuerth Elektronik, Microsemi/Richardson RFPD, ON Semiconductor e Rutronik.
Program of the day
From 9.30 to 17.30 – will host the conference session; starting from 9.00 it will be possible to register.
Sala Rossini
Plenary 1 , SiC, GaN and Si contend the scene.
New technologies WBG (Wide BandGap), or SiC (Silicon Carbide) e GaN (Gallium Nitride) promise new levels of efficiency and are ready to unseat the old Silicon applications of power that, let's ask ourselves, He intends to defend its positions.
9.40: Introduction - Franco Musiari, Assodel,
9.50 - The electronic power view from an advanced laboratory - Prof. Roberto Petrella, EDLab, University of Udine
By "ELECTRIC DRIVES LABORATORY" University of Udine vision on the developments that are driving the power electronics with the experience coming from the most prestigious Italian industries in the sector with which EDLab collaborated in the development of cutting edge products.
10.20 - Tecnologia GaN: una nuova prospettiva, ricca di sfide, per l’elettronica di potenza - Andrea Bricconi, Infineon Technologies
I dispositivi in tecnologia GaN sono già stati proposti da alcuni anni nel mercato dei semiconduttori da varie aziende, ma non hanno ancora raggiunto una quota di mercato significativa. La presentazione vuole discutere le ragioni che rendono l’introduzione dei dispositivi in GaN una sfida e proporre dei suggerimenti sui cambiamenti in ambito progettuale necessari rispetto alle tecnologie convenzionali.
10.40 - ST solutions for PFC (Power Factor Correction) multiphase interleaved - Natale Aiello, STMicroelectronics
The stadium PFC can be passive or active. In the first case it is required large capacitors and inductors, while in the second case are used of the electronic circuits (typically converters Boost) which convert the high frequency signal. The main advantage of the solution is active in the high power density that can be achieved.
11.00: Visit exhibition and coffee break
11.30: New C3M MOSFET technology – Benefits and target applications - Edgar Ayerbe, Cree Power a cura di Richardson RFPD
Cree has introduced a new 900V SiC MOSFET platform along with a new surface mount package. Together they form an optimized solution for tomorrow’s high-frequency power applications.
11.50: Power Semiconductor Solution for Welder Inverter - Kent Feng, MacMic Science & Technology a cura di Edo Components
MacMic Science and Technology is a Chinese hi-tech company, composed mainly by scientists and engineers, that have developed its own Silicon technology and producing from components to module. In this presentation MacMic will analyze the technology solutions designed expressly for welder inverter.
12.10: 10KW 3-Level SiC Inverter for Motor Control - Andrea Colognese, Rohm Semiconductor
L’utilizzo di dispositivi mosfet Silicon Carbide ROHM in un inverter 3 level per controllo motore (e applicazioni di potenza in genere) per ridurre distorsioni e aumentare la densità di potenza nella conversione DC-to-AC. (in collaborazione con Xilinx & QdeSys).
12.30: La 7a generazione di moduli IGBT: nuovi livelli di efficienza e riduzione dei volumi - Massimo Caprioli, Fuji Electric
Il mercato dei sistemi di conversione continua a richiedere dimensioni più ridotte e maggiore efficienza. Una maggiore densità di potenza dei moduli è la chiave e la sfida è una maggiore affidabilità con temperature di giunzione più elevate. Un ulterior miglioramento delle caratteristiche dei chip e lo sviluppo di nuovi materiali e delle tecnologie dei package ha portato alla 7a generazione dei moduli di Fuji Electric
12.50: Visita area espositiva e finger buffet
Room Paisiello
Plenary 2 – Solutions, architectures and support.
Management, architectures, design methodologies and measures are an essential corollary to realize imagine, develop and complete a project in the world of power conversion.
9.30: Introduction - Roberto Armani, Assodel,
9.40 - Revolutionize Auxiliary & Standby Power Supplies with New 725 V InnoSwitch-EP ICs - Sergio Aveta, Power Integration
Usando la rivoluzionaria tecnologia Fluxlink è possibile realizzare SMPS semplici e con una regolazione eccezionale senza utilizzare fotoaccoppiatori. Si mantiene la semplicità della BOM della architettura ‘Primary Side Regulation’ ma con un trasformatore più semplice e con ottime prestazioni ai transitori.
10.00 - Nuove soluzioni per la caratterizzazione la misura ed il test rivolte al mondo delle applicazioni power. Gabriele Vittori, Keithley/Tektronix a cura di RS Components
Nel design di nuovi prodotti o di schede elettroniche per applicazioni power, è necessario valutare la nuova componentistica, procedere al debug del prototipo e se necessario si deve essere in grado di valutare le motivazioni di failure. I nuovi prodotti come i Parametric Curve Tracer di Keithley sono in grado di soddisfare queste necessità in modo semplice e rapido.
10.20: Metodologia di progettazione di potenza mediante componenti modulari - Massimo Gavioli, Vicor a cura di Arrow
Un approccio veloce ed efficiente, alla progettazione di alimentazioni di potenza partendo dalla rete fino ai punti di carico con componenti standard e modulari.
10.40: Keysight new solutions for testing of Power Converter in static and dynamic conditions - Giacomo Tuveri, Keysight Technologies
The design or selection of devices for converting DC or AC is running a series of measures to define the quality of the object. In addition to the classical ones (W, WHERE,VA, PF, etc.) you need to evaluate the behavior of the device under the possible disturbances on the AC line
11.00: Visit exhibition and coffee break
11.30: Soluzioni Wireless Charging Medium and Low Power - Alberto Stroppa, Rutronik
Wireless Charging Solutions, already established in the consumer / Mobile, They are the new frontier technology for industrial and automotive markets with huge growth prospects in the coming 5 age. Rutronik presents new proposals of Medium and Low Power ROHM Semiconductor.
11.50: DC/DC Converters for IGBT, SiC and Other Gate Drivers - Steve Roberts, Recom Engineering
The presentation will cover a basic introduction to high speed switching applications, discuss the gate driver requirements for different switching technologies (IGBT, SiC, GaN, Cascode, etc.) and the appropriate choice of isolated DC/DC converter to power these gate drivers.
12.10: Soluzioni integrate e innovative per sistemi di backup - Maurizio Pogliani, Linear Technologies a cura di Arrow
Lo sviluppo tecnologico ha creato un forte incremento dell’uso di supercapacitor come unità di storage in sostituzione delle batterie. Ciò richiede l’impiego di più DC/DC converter di diversa topologia, che Linear Technology offre in un unico package integrando inoltre funzioni di carica, bilanciamento e diagnostica dei supercap.
12.30: Soluzioni innovative di isolamento per sistemi di potenza ad alta efficienza - Massimiliano Morelli, Silicon Labs a cura di Melchioni
La continua richiesta di migliore efficienza e di compattezza nei sistemi di potenza porta il progettista ad incrementare le frequenze di switching dai quali nascono potenziali problemi di immunità ai transient.L’innovativa tecnologia di isolamento galvanico sviluppata da Silicon Lab consente di far fronte a tutte queste problematiche con soluzioni efficienti ed a basse emissioni elettromangnetiche.
12.50: Visita area espositiva e finger buffet
Afternoon Session – workshop ed educational
Room Ponchielli
Educational
14.00: Low Voltage Drives – 1kW motor drive for power tools. Design and waveforms considerations on live demo - Elvir Kahrimanovic, Infineon Technologies
This low voltage drive seminar will focus on a design of an inverter power stage used in Brushless DC motor in block commutation. An example of 1kW full system demonstrator will be presented. The presentation will also focus on how to selects the appropriate MOSFET, select switching frequency, choose the gate resistor and quantify power losses generated in the MOSFET, i.e. breakdown of switching, conduction, diode losses. The importance of the thermal management will be discussed, and a thermal solution proposed for SMD package such as SuperSO8 (PQFN 5×6).
15.45: High Voltage Drives: Focus on Integrated Power Modules. Design and waveforms on live demo - Marco Palma, Infineon Technologies
Appliances and electronic equipment industrial low power today must be more efficient. All motors in these applications must be controlled with variable speed to ensure maximum efficiency. The control speed 'variable motor is obtained using the inverter technology. During the workshop will discuss the solutions based on integrated power units Infineon and releative board modular applications to quickly design.
A limited number of recordings - compulsory registration
Per iscrizioni scrivere a
Sala Palestrina
Workshop
14.00: Mitsubishi Electric 7th Generation Industrial IGBT Modules -Technologies & Benefits - Satoshi Miyahara by Hussein Khalid, Mitsubishi Electric Europe a cura di Melchioni
Mitsubishi Electric 7th Generation IGBT modules offer substantial benefits for industrial applications through the combination of 7th Gen. chip technology and two packages: NX and standard (Std) types. Keeping its present package compatibility, the new NX package features the SLC (solid cover) technology where resin potting and insulation are utilized for higher reliability. Also, the Std. package is offering lower Rth(j-c) and improved reliability through the utilization of the TMS technology where the Thick Metal Substrate concept optimizes its heat dissipation and greatly extends the thermal cycling capability.
14.45: Compact connector series delivering high-power and superior performance for industrial applications - Wienhold Jörg, Hirose by Orvem
Overview of connections within Industrial market, such as Wire-to-Board and Board-to-Board. New product family EnerBee and FunctionMax and what is the message behind
Room Cimarosa
Workshop
14.10: Red Expert – Andrea Marani e Fabrizio Lelli - Würth Elektronik
Il “Red Expert”, tool software online sul sito della Wurth Elektronik eiSos GMBH: funzionalità e utilizzo come supporto alla progettazione di parti magnetiche per storage del catalogo della casa di componenti passivi tedesca. Esempi applicativi e utilizzo.
14.55: SiC MOSFETs - James Kerr, Microsemi a cura di Richardson RFPD
Silicon Carbide (SiC) semiconductors are an innovative new option for power electronic designers looking to improve system efficiency, reduce form factor, and operate at higher temperatures in products for industrial power applications. Market trends are quickly moving toward higher energy efficient systems by reducing energy losses through new technology like SiC. SiC MOSFETs are available in 700V, 1200V, and 1700V and are an ideal replacement for IGBTs and Superjunction MOSFETs.
Bellini Room
Workshop
14.15: Future Trend in Packages of the latest ON Semiconductor IGBT’s technologies - Vittorio Crisafulli, ON Semiconductor
Technology has moved beyond simply transforming how we live. Power Semiconductor’s Industry has come a long way in the last century. If the focus of yesterday was mainly on the silicon side, today it has extended as well to the mechanical side. Packages have become center of gravity of the transistor development together with the new silicon technologies as a focus part of the semiconductor puzzle. The need of having compact and reliable systems has driven the applications designers to look into new solutions able to work reliably also in high frequency range and under harsh conditions. ON Semiconductor is extensively working on new developments. The aim of this work is to provide an overview of the Future trends in Packages of the latest ON Semiconductor IGBTs technologies.
15.00: Innovative approaches to power conversion - Christian Flight and David Osto, Rutronik
Rutronik presents new proposals in the power conversion attarverso a critical analysis of digital control
and new technologies in the field of passive components (hybrid capacitors and supercup.).
in collaboration with:
Power Fortronic 2014 - 18 September, Bologna
With over 500 operators in the sector, the eleventh edition of the Power Fortronic signed the success and confirmation of a key event for manufacturers, suppliers and customers that operate in the world of power electronics.
The exhibition-conference has offered many visitors a rich and attractive program of conferences and workshops, and a large exhibition area occupied by over 50 stand, opportunity to "touch" the latest news on the dynamic technology market power.
Among the topics covered
- Power Semiconductors and smart energy applications.. trying to look into the future! – Infineon Technologies
- 6th and 7th generation power modules for industrial applications – Mitsubishi Electric
- Design criteria of power capacitors MKP and development of the film at high temperature – Ducati Energia
- Power Semiconductors - Package for the innovative technology of the future – Fuji Electric
- CONCEPT: Electrolytic a modular 700 to 1200 Volts and up to 250ARMS for power application – Kendeil
- Piloting efficient electric motors - STMicroelectronics
- Optimize the inductance looking to ripple on the output - Coilcraft
- A battery with the knob? Need, tips and solutions for the laboratory power supply – Keysight Technologies (Agilent Technologies)
- TO Leadless—A new package for high current and high reliability applications – Infineon Technologies
- Power Solutions for driving motors and industrial drive applications – Texas Instruments
- Busbar: a necessity in connections High Power - EC&C
- Cree PV Inverter Tops the 1kW/kg Mark with All-SiC Design – CreePower
- Advanced Technologies of Aluminum Electrolytic Capacitors for Power Electronics Applications – Nippon Chemicon
- Power devices technology update (SiC Devices/IGBT/SJ-MOSFET) – Rohm Semiconductor
Power Fortronic 2013 - 19 September, Bologna
The power electronics does not disappoint: with over 500 operators and 60 sponsor companies, the X edition of Power Fortronic, organized by Assodel highlighted the steady growth of a dynamic sector, full of proposals and talking points, and confirmation of an annual must for manufacturers, suppliers and customers operating in the power segment.
Among the topics covered
- IGBT Technology & Market Overview, plus Wide Band Gap Perspectives – Yole Développement
- How to use SiC to reduce the overall system cost in power electronic applications – CREE Power
- ΜIPM IR modules and their application without heat sink. Fundamental thermal considerations – International Rectifier
- Power storage: tools and methods to support the Battery Management – Agilent Technologies
- Volts jolts,Mills kills! As the PSU medical you "connect" to patients – TDK- Lambda
- 2There nd. SiC MOSFET, SuperJunction and IGBT technologies for new Hybrid MOSFETs – ROHM Semiconductor’s Technologies
- Prospects of silicon carbide: revolutionize power applications improving performance – STMicroelectronics
- IXYS latest thin wafer IGBT technology and innovative SMD modules – IXYS Corporation
- DC/DC Converters Used to Power IGBT Drivers – Recom
- Comparing new high speed 1200V IGBTs with SiC BJTs including drive methods – Fairchild Europe
- High Power Contactor applications – GIGAVAC
- Design criteria of the capacitors (Electrolytic / film) reduction and cost optimization circuit – Kendeil
- Application advantages in the use of IGBT fast for the industrial and consumer – Infineon Technologies Austria
Power Fortronic 2012 - 20 September, Bologna
With 520 operators in the sector, the ninth edition of the Power Fortronic, organized by Assodel, has signed the success and confirmation of a key event for manufacturers, suppliers and customers that operate in the world of power electronics.
The exhibition-conference has offered many visitors a rich and attractive program of conferences and workshops, and a large exhibition area occupied by over 50 stand, opportunity to "touch" the latest news on the dynamic technology market power
Nourished in the conference session, between topics, we talked about:
- Amorphous cores converters for high efficiency – Acal BFI Italy
- DC / DC high power density and low thermal impedance – Intersil
- Efficiency in power supplies from another perspective: losses and measures – TDK-Lambda
- SiC Bipolar Transistors and Solutions for their drive circuit – Fairchild
- Ultra low Ron SiC Trench devices – Rohm Semiconductor
- Direct comparison between different technologies in SiC – STMicroelectronics
- An intelligent and integrated solution for IGBT driving – Ct-Concept Technologie
- Innovative technologies of IGBT and diode to new levels of efficiency- Infineon Technologies Austria
- Higher Performance by using the authentic RB-IGBT in T-Type configuration – Fuji Electric Europe
Power Fortronic 2011 - 27 October, Bologna
Even in this eighth edition, Power Fortronic has been a significant influx of professionals – about 400 total.
Exposure even richer – 55 stand + an area totally dedicated to products and solutions by Arrow – did surround a large selection of technical topics.
Among the various activities of the conventions:
- More power for engine control, power and lighting – Renesas
- The genesis of a power module: Genesis – Vishay e Ebv Elektronik
- The technology "Seamless Ranging" to measure the dynamic currents from nA to A. , Agilent Technologies
- Change of topologies by using SiC Transistors – SemiSouth
- Digital Power: theory and benefits – TDK-Lambda
- Power conversion – analog or digital? This is the dilemma! –Intersil
- The evolution of the technologies of the semiconductor switches to overcome the limitations of today – Infineon Technology
Consorzio Tecnoimprese
Via Console Flaminio, 19 20134 Milano MI, Italy
tecnoimprese.it
Power Fortronic – 17 September 2015
Zanhotel & Meeting Centergross
Power Directory
The protagonists in the world of power electronics.
Power News
News from the world of power electronics by the editorial staff of A&V Elettronica
Registration at Power Fortronic 2015
L & rsquo; s entry to the forum & egrave; free for guests of exhibitors, to the industry and more & ugrave; generally to companies that purchase power electronics. The Secretariat will confirm the participation according to the indication of the "Committee Exhibitors"
Once registered, You can be updated on all the latest news, appointments and special events planned, thanks for our newsletter.
The access pass will be sent directly to the email address you indicate when you register